Data Center Subfloor Encapsulation  
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Subfloor encapsulation incorporates the application of a Polyepoxide coating to the concrete subfloor plenum surface that acts as a vapor and dust barrier. Concrete Sealing should be applied manually to the surface of the subfloor plenum. Installing a Subfloor encapsulant is one of the best ways to reduce concrete dusting and subsequent airborne particulate concentrations in your data center.


Benefits

Good bonding properties

Low VOC

Non flammable

No shrinking after curing

Seal the decorated concrete eliminating air borne dust particle

Help maintain dust free environment

Excellent chemical resistance

Solvent-free formula, virtually odorless

High build formula Suitable for concrete in interior applications

Resistant to oil, solvents and harsh cleaning chemicals

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